Solder Joint Reliability Prediction for Multiple Environments

By Perkins Andrew Eugene, Sitaraman Suresh K.

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Availability: 2 days
Format: Hardcover (Other Formats)

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Additional Information

Publisher:	Springer
Publication Date:	10/31/2008
ISBN:	9780387793931
EAN:	0387793933
Paperback:	192 pages
Language:	English
Physical Info:	0.00 x 0.00 x 0.00 inches
Categories:	Electronics - Microelectronics \| Optics \| Metallurgy

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